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High Performance thermal interface material
Good bulk conductivity
Excellent thermal impedance
< 40 μ max particle diameter
Specifications
High Performance thermal interface material
Good bulk conductivity
Excellent thermal impedance
< 40 μ max particle diameter
Non-silicone material
Thin interface to offer low thermal resistance
Good wet-out
3M™ Thermally Conductive Grease TCG-2035 is an ultra-high performance thermal interface material for transferring thermal energy from a heat source (e.g.: processor chip, graphics chip, etc.) to a heat sinking or heat spreading surface.
