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Higher Thermal Conductivity & Thicker ECATT for gap filling
Isotropic XYZ-axis electrical connectivity
High adhesion acrylic adhesive
Improved conformability
Higher Thermal Conductivity & Thicker ECATT for gap filling
Isotropic XYZ-axis electrical connectivity
High adhesion acrylic adhesive
Improved conformability
Isotropic XYZ-axis electrical connectivity
Bridges wider gaps
Unique particle design allows better resistance in a thicker product
Works well on softer surfaces such as gold to gold
Higher contact resistance on harder surfaces such as stainless steel
Can be applied as die-cut parts or in roll form
3M™ eCAP 7850 is a high adhesion, double sided tape consisting of a 3M adhesive loaded with conductive carbon particle fillers and is ideal for EMI/RFI shield and EMI/RFI gasket to metal surface attachment.
Additional Information
The PSA matrix is filled with carbon fillers which allow thermal and electrical interconnection between substrates through the adhesive thickness (the "Z-axis") and also provides electrically conducting in the plane of the adhesive ("X-Y Axis").