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Alpha Metals RF800T 免洗助焊剂 No-Clean Flux FEATURES BENEFITS • Medium Solids Content • Pin Testable • Non Corrosive Residues • High Sir Assemblies DESCRIPTION Alpha RF 800T is a low solids, no-clean flux formulated with a small percentage of rosin and non-halide activators. This unique rosin activation system promotes excellent wetting to protected copper and solder coated surfaces. Post soldering residue of Alpha RF 800T is minimal, slightly glossy and can be pin tested without removal. USE Alpha RF 800T flux is formulated to be applied with foam, wave, spray and mist fluxers. Flux deposition, density and uniformity are critical to successful use of low solids no-clean flux. Applying RF 800T to a dry flux coating density of 100 to 300 micrograms per square centimetre is recommended. Preheating the circuit assembly will partially dry the flux, enhance oxide removal and promote optimum wicking, as well as superior solder joint formation. Degree of preheat is dependent on many variables; such as conveyor speed, type of components and substrates. Entering the solder wave with a top-side temperature of 90°C to 110°C and a bottom-side temperature of 120°C to 155°C is typical. The foam applicators should be supplied with compressed air, free of oil and water. Maintain flux fluid level sufficiently above the aerator to produce adequate foam height. Adjust air pressure to produce optimum height with foam consisting of uniform bubbles. The addition of flux thinners will be required to replace evaporative losses and maintain the balance in flux composition. Due to the low solids content of Alpha RF 800T flux, specific gravity is not an accurate measure for assessment. Monitoring and controlling the acid number is recommended for maintaining the flux composition. The acid number should be controlled between 21 and 22. In time, debris and contaminants will accumulate in recirculating type flux applicators. For consistent soldering performance, dispose of spent flux in accordance with local bylaws, rules and regulations periodically. After emptying used flux, the reservoir and applicator should be thoroughly cleaned with flux thinner. Refill reservoir with fresh flux and allow a few minutes to stabilise before resuming soldering operation. In this type of flux application equipment, replace flux every 3 days where used daily for eight hours or more. Although Alpha RF 800T is designed to be left on the board, if desired, post soldering residues can be removed with Alpha 2110 saponifier, Hydrex DX detergent or alternatively a semi-aqueous process using Alpha Auto Clean 40 may be employed. Key factors for no-clean soldering: Start with clean boards and components. Maintain uniform flux coating. Separate boards to prevent flux carry-over. Parameters Typical Values Parameters/Test Method Typical Values Appearance Pale, yellow liquid Recommended Thinner 800T Additive Solids Content, wt/wt 5.0 Shelf Life 18 Months Acid Number (mg KOH/g) 21.6 Container Size Availability 20, 200L Specific Gravity @ 25°C (77°F) 0.800 ± 0.003 Bellcore TR-NWT-000078, Issue 3 Compliant Yes Flash Point (T.C.C.) 13°C IPC J-STD-004 Designation B (RO/L1)
