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ALPHA OM5000含铅锡膏 HIGH SPEED, PIN TESTABLE, SOLDER PASTE DESCRIPTION ALPHA OM-5000 is a no-clean solder paste formulated for optimum performance in a wide variety of applications. The semi-soft, highly reliable residues provide a very low incidence of first probe false readings. ALPHA OM-5000 can be squeegee or pump printed at high speeds. FEATURES & PROCESS BENEFITS • Alpha OM-5000 prints at squeegee speeds up to 200mm/sec with consistent print volumes and definition after pauses up to 7 hours. • Excellent resistance to hot and cold slump for(Contour stability) minimizing bridge formation. • Excellent wetting characteristics and cosmetics on all types of pad finishes (incl. OSP) even after multiple reflow excursions. • Penetrable post reflow flux residues to maximize pin testability (ICT). • ALPHA OM-5000 exhibits long stencil and tack life > 8 hours (25-75% RH). AVAILABILITY • Alloy: 63Sn/37Pb, 62Sn/36Pb/2Ag • Rheology: Squeegee & Pump Printing (MPM Rheopump and DEK ProFlow) • Metal Percentage: 90% • Powder Size: Type #3 (-325+500 mesh per IPC J-STD-006) • Packaging Sizes: Small and large jars, 6” and 12” cartridges and ProFlow TM cassettes. APPLICATIONS Formulated for standard and fine pitch printing through stencil apertures as small as 0.007 inches (0.2 mm). Suitable for use across a wide variety of process settings. ALPHA OM-5000 is especially suitable for printing on assemblies that will receive in circuit test probing. SAFETY While the ALPHA OM-5000 flux system is not considered toxic, its use in typical reflow will generate a small amount of reaction and decomposition vapors. These vapors should be adequately exhausted from the work area. Consult the MSDS for additional safety information, and for toxicity data on alloys containing lead and silver.
