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■本产品适用于各种FPC,COF,TAB与LCD panel 及PCB的组合邦定。 Application: The machine is used for bonding FPC, COF, TAB onto various LCD panels and PCB. 工艺应用：■电视机液晶屏 ■显示器液晶屏 ■笔记本液晶屏 Technic Application: ■ LCD TV ■LCD display ■Laptop display 产品规格： Specification: 客户可根据设备温度方式及设备兼容Panel 尺寸进行选择 Customized Heating Mode and Compatible LCD Panel 设备型号 Model XCH71-A5 XCM71-A5 温度方式（可选） Heat Mode 恒温加热型 Constant Heat 脉冲加热型 Pulse Heat 设备规格（可选） Max LCD size 17寸内 17 21寸内 21" 26寸内 26" 17寸内 17" 21寸内 21" 26寸内 26" ■功能特点： Key Feature: ■SUNSOM压力系统双缸结构可消除压头头自重，压力最小精度可达0.1kg. Double cylinders of SUNSOM pressure system can eliminate the self-gravity. Minimum pressure accuracy is 0.1kg. ■高中低档脉冲源设计、满足多元化产品压力的功率要求。 Multi-level pulse source design meet the pressure requirement of diversified products. ■伺服记忆功能及自动走位功能开发满足了对位至组装及维修的效率要求。 Servo memory function and auto-location function meet the efficiency of alignment, assembly and repair work. ■压力部件采用日本SMC精密元件。 Japanese precise SMC pressure components. ■间隙式真空吸附于压头组工作交替配合，节省了近1/2吸附时间且降低了气源损耗 Interstice vacuum suction of bond head rotary work, save one second suction time and reduce the gas wastage.
