供应COG双头本压设备

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关 键 词：COG双头本压设备

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发布时间：2010-07-17

本产品适用于各种液晶（LCD glass)于驱动IC本压邦定。
Application:
The machine is used for bonding IC driver to various LCD glasses.
工艺应用：STN   CSTN   TFT
Technic Application:  STN   CSTN   TFT


功能特点：
Fey Feature:
■ SUNSOM压力系统双缸结构可消除压头自重，压力最小精度可达0.1kg.
Double cylinders of SUNSOM pressure system can eliminate self-gravity of bond head, minimum pressure accuracy is 0.1kg.
■ SUNSOM压头结构采用2组精密滑轨主定位，直线轴承辅助定位，适用于各种高精度产品本压接。
Two sets precise slide rail of SUNSOM bond head position, linear bearing assist  position, applied to various high precision product bonding.
■ 上下加温方式、4套控温系统，满足多元化产品本压要求。
Top and bottom constant temperature heating and four temperature controlling system meet to diversified product bonding.
■ 自动式卷皮及双位夹具固定式工作，精度及效率大大提高。
Auto rolling and double fixtures fixed work greatly improve accuracy and efficiency.
■ 预热头采用中心凹面结构，选用进口超硬材质刀头，保证高品质的本压要求。
Concave structure of pre-bonding head, imported high rigid bond head, ensure product bonding efficiency.