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ComIoT 19模块是由深圳市动通科技有限公司研发生产的完整路由核心模块。集成1个2.5G网口和4个1G网口,支持802.11 a/b/g/n/ac/ax协议,可提供多种场景的WiFi 6解决方案。它针对低功耗、高集成度的WIFI6 AP和路由设备进行了优化,只需要简单的外部接口设计即可使用。 该模块是基于MT7981设计的,MT7981是一个双核ARM Cortex-A53 CPU,主频为1.3GHz。WIFI芯片采用MT7976CN,支持双频802.11a/b/g/n/ac/ax 2x2 MIMO,最大带宽可达3000Mbps。该模块同时支持AP模式和客户端模式,包含大量的业务应用软件,减少了客户的研究和设计工作。 产品特性 基于MTK MT7981B+MT7976C+MT7531AE+GPY211的解决方案 2.4GHz支持WiFi6,最高速度573Mbps 5GHz支持WiFi6,最高速度2402Mbps 支持动态频率选择(DFS) 内存支持DDR3 256MB 支持32mb SPI NOR Flash 支持扩展256MB NAND闪存 以太网端口支持2.5Gbps 支持USB 2.0和USB 3.0 支持串行和多GPIO Hardware Specifications Main Chipset MTK MT7981B+MT7976C+MT7531AE+GPY211 Flash SPI NOR Flash 32MB (Optional Max NAND Flash 128MB) Memory 256MB(Optional Max 1GB) RF Frequency 2.40~2.4835GHz & 5.725~5.850GHz WiFi Standards 802.11a/b/g/n/ac/ax(2X2) Modulation 11b: DBPSK, DQPSK and CCK and DSSS 11g: BPSK, QPSK, 16QAM, 64QAM and OFDM 11n: MCS0~15 OFDM 11a:BPSK, QPSK, 16QAM, 64QAM 11ac:BPSK, QPSK, 16QAM, 64QAM, 256QAM,OFDM 11ax:BPSK, QPSK, 16QAM, 64QAM, 256QAM, 1024QAM, OFDMA Theoretical Bandwidth 11b:1, 2, 5.5 and 11Mbps 11g:6, 9, 12, 18, 24, 36, 48 and 54 Mbps 11n: MCS0~15,MIMO up to 300Mbps 11a:6, 9, 12, 18, 24, 36, 48 and 54 Mbps 11ac:wave2,MU-MIMO,up to 867Mbps 11ax:2.4Ghz up to 573Mbps,5.8GHz up to 2402Mbps Board to Board Connector 120Pin Connector Main Interfaces Ethernet*5 UART*2 USB2.0*1 or USB3.0*1 PCB 4 Layer Size / Weight 82mm x 80mm x 12mm / 105g (Including heat sink) Antenna Standard IPEX Operating Temperature -20°C to +70°C Storage Temperature -40°C to +90°C Humidity 5% ~ 95% Static Protection Human Body Model: -2KV ~ +2KV Static Protection Machine Mode: -200V ~ +200V Operating Voltage 12V +/-10% Average Power Consumption 6W Cooling Size (Recommended) 60*80*7mm Note: the wifi6 chip operates and has high thermal temperature, the module temperature needed to be in control below ≤70° GPIO Output Voltage 3.3V +/-10%