价格：16起
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产品规格：10
产品数量：67 个
包装说明：支装
关 键 词：LOCTITE3005封装剂,乐泰LOCTITE3005,LOCTITEECCOBOND3005
发布时间：2023-06-27
LOCTITE ECCOBOND 3005 adhesive is designed for lid attach in flip chip BGA applications The combination of product features result in superior flip chip BGA reliability This material is sensitive to amines, phosphorus, sulfur and tin containing components This material needs to be isolated from uncured epoxy-based resins as interaction will inhibit curing
