3M™ Thermal Bonding Film 583

价格：面议

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行业：灯饰灯具绝缘材料电工胶带

发布时间：2022-10-07

Flexible
Heat or solvent activation
Can be die-cut
Slight surface tack

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Specifications

Adhesive Thickness
2.0 mil
Adhesive Thickness (metric)
0.05 mm
Adhesive Type
Thermoset
Application Category
Bonding
Applications
Bezel Bonding, Case Assembly, Flex Bonding, Flex Stiffener Bonding, Glass Cloth Splicing for PCB, Low Surface Energy Bonding
Base Material
Nitrile Phenolic
Bond Cure Time
5 Minutes
Bondline Temp (Celsius)
121 degree C
Bondline Temp (Fahrenheit)
250 degree F
Bond Type
Permanent
Brand
3M
Elongation
800% (Before Crosslinking)
Face-Side Liner Thickness
3 mil
Face-Side Liner Thickness (Metric)
0.08 mm
Face-Side Liner Type
Silicone Paper
Film Color
Brown
Maximum Width Available
48 Inch
Maximum Width Available (metric)
1200 mm
Product Form
Roll
Product Series
583
Substrates
Aluminum, FR-4, Steel (Cold Rolled, Stainless)

Details

Flexible
Heat or solvent activation
Can be die-cut
Slight surface tack
Heat crosslinkable option
Lower temperature lamination of the nitrile phenolic film range

3M™ Thermal Bonding Film 583 is a high strength, flexible, nitrile phenolic based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.

Additional Information
This hot melt film adhesive provides a strong, permanent bond to the surface to which it is applied. The adhesive can be used for splicing of glass fabric during PCB board manufacturing. Can be solvent activated in the uncured form.

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