饮料机ROHS证书 *性高
价格：1000.00起
产品规格：
产品数量：
包装说明：
关 键 词：饮料机ROHS证书
行 业：商务服务 认证服务
发布时间：2020-01-19
豁免项
简述
由于技术问题，部分材料或者产品的制造技术还做不到ROHS指令要求，在经过向欧盟的特殊申请后，以下项目可以获得豁免（部分豁免是有期限的）：
RoHS ExemptionsEU RoHS
Items Exemption Clauses
原有
1 Mercury in compact fluorescent lamps not exceeding 5 mg per lamp
2 Mercury in straight fluorescent lamps for general purposes not exceeding:
- halophosphate 10 mg
- triphosphate with normal lifetime 5 mg
- triphosphate with long lifetime 8 mg.
3 Mercury in straight fluorescent lamps for special purposes.
4 Mercury in other lamps not specifically mentioned in this Annex.
5 Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.
6 Lead as an alloying element in steel containing up to 0.35% lead by weight, aluminium containing up to 0.4% lead by weight and as a copper alloy containing up to 4% lead by weight.
7 - lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)
- lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, **ling, transmission as well as network management for telecommunications
- lead in electronic ceramic parts (e.g. piezoelectronic devices).
8 Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC (1) amending Directive 76/769/EEC (2) relating to restrictions on the marketing and use of certain dangerous substances and preparations
9 Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators.
10 Lead used in compliant pin connector systems
11 Lead as a coating material for the thermal conduction module c-ring
12 Lead and cadmium in optical and filter glass
13 Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight
14 Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages
15 DecaBDE in polymeric applications
16 Lead in lead-bronze bearing shells and bulbs
17 Lead in linear incandescent lamps with silicate coated tubes
18 Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography applications
19 Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) as well as when used as specially lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb)
20 Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL)
21 Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD)
22 Lead and cadmium in printing inks for the application of enamels on borosilicate glass.
23 Lead as impurity in RIG (rare earth iron gamet) Faraday rotators used for fibre optic communication systems.
24 Lead in finishes of fine pitch components other than connectors with a pitch of 0.65mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65mm or less with coppler lead frames.
25 Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.
26 Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements, notably in the front and rare glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes.
27 Lead oxide in the glass envelope of Black Light Blue (BLB) lamps.
28 Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers.
29 Hexavalent chromium in corrosion preventive coatings of unpainted metal sheetings and fasterners used for corrosion protection and Electromagnetic Interference Shielding in equipment falling under category three of Directive 2002/96/EC (IT and telecommunications equipment). Exemption granted until 1 July 2007.
30Lead bound in crystal glass as defined in Annex I (Category 1,2,3 and 4) of Council Directive 69/493/EEC
新增
2009年6月11日，欧盟OJ刊登了2009/443/EC，新增了6项RoHS指令的豁免，分别如下：
33. Lead insolders for the soldering of thin copper wires of 100 μm diameter andless in power transformers. 电力变压器中直径100微米及以下细铜线所用焊料中的铅
34. Lead in cermet-based trimmer potentiometer elements. 金属陶瓷质的微调电位计中的铅
6月5，欧盟刊登了2009/428/EC，从2011年1月1日起，将原豁免的*22点“光纤通讯系统稀土铁石榴石法拉*旋转器中作为杂质的铅”从豁免列表中移除。
ROHS
2011年7月1日，欧盟议会和理事会在欧盟公报上发布指令 2011/65/EU（ROHS 2.0）以取代2002/95/EC 新指令将于20天后（即2011年7月21日）生效。
申请日期：
2013年1月3日起指令2002/95/EC将会被废除，盟国必须于2013年1月2日前将指令2011/65/EU更新到当地法律。
在2002/95/EC规范外的且不受更新指令约束的产品，将可继续再市场上出售直至2019年7月22日，这将意味着经营组织可继续在欧盟市场上分销或使用产品做商业用途付费或免费。
2011/65/EU 主要内容概括如下：
1.产品范围
阐明了指令管控范围和相关定义，将管控产品范围扩大至除特殊豁免外的所有电子电气设备：
— 包括被2002/95/EC 豁免的第8类产品医疗设备、第9类产品监控设备；
— *11类产品：不被1~10类产品涵盖的其他所有电子电气设备，包括线缆及其它零部件。
2.限制物质
虽然并未增加新的限制物质，但选定4种有毒有害物质（HBCDD、DEHP、DBP和BBP）作为限制物质的候选。
3.CE标志要求
将电子电气设备ROHS符合性纳入CE标志要求。生产者在张贴CE标识时应确保产品符合ROHS并准备相应的声明和技术文档。
4.过渡期规定
为使新纳入ROHS 2.0管控产品的生产商有充分时间来符合指令要求，ROHS 2.0为相关产品设定了管控过渡期。
— 医疗设备和监控设备及其零部件自2014年7月22日起应符合ROHS2.0;
— 体外诊断医疗设备及其零部件自2016年7月22日起应符合ROHS2.0;
— 工业监控设备及其零部件自2017年7月22日起应符合ROHS2.0;
— 其它新纳入ROHS2.0管控的产品自2019年7月22日起应符合ROHS2.0;
5.豁免机制
采纳现有豁免条款并针对医疗和监控设备提出了20项新豁免，同时针对产品类别规定了不同的豁免长有效期：
— 2002/95/EC原先管控的8大类产品和*11类产品的豁免有效期长为5年；
— 而第8类和第9类产品豁免有效期长为7年。
6.增加市场监督条款
引入统一的产品符合性评估要求和市场监督机制。通过严格且统一的市场监管来减少市场不不符合产品的数量，从而有效地达成指令目标。
相关生产商应该深刻理解指令要求并及时采取应对措施，以确保产品符合ROHS2.0提出的新要求。
医疗设备：ROHS 2.0与其它限用物质要求
● 2011年7月1日，ROHS 2.0（2011/65/EU）正式在欧盟公报上发布，并将于20天后正式生效。
● 相对原ROHS指令2002/95/EC，ROHS 2.0的一大变化在于其将包括医疗设备在内的所有电子电气产品纳入管控范围。
● 考虑到ROHS 2.0对医疗设备提出的新要求，世界**医疗器械制造商G公司和P公司已开始对ROHS及其它限用物质展开排查和管控。
ROHS 2.0主要内容如下：
— 阐明了指令管控范围和相关定义：
— 将医疗及监控设备纳入ROHS管控范围；
— 增加*11类产品，即不被原先10类产品涵盖的其他电子电气设备；
— 虽然并未增加新的限制物质，但选定4种有毒有害物质（HBCCD、DEHP、DBP和BBP）作为限制物质的候选。
— 将电子电气设备ROHS符合性纳入CE标识要求。
-/gbafaec/-
