爱博斯迪科2035SC替代品，代替品ab

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发布时间：2013-06-17

	 
	爱博斯迪科2035SC替代品，代替品ablestik2035
	one component epoxy adhesive,
	which has high shear strength with image sensor die
	during high temperature bonding process such as hotbar
	or ACF bonding. It is designed to have high T.I and
	viscosity to prevent die rotation or tilt problem.
	Typical Application
	Die Attach Adhesive
	Property of Material
	Color Pink
	Specific Gravity 1.44
	Viscosity (Brookfield C&P HBDV-II,
	Spindle #51, 25°C)
	5 RPM 38,000 cps
	Thixotropic Index 4.7
	Work Life @ 25°C, days 3
	Shelf Life @ -15°C, months 6
	 
	Physical Properties
	Gel Time @ 100°C, Hot plate 1M 15S
	Hardness (Shore D) 86
	Glass Transition Temperature (Tg) 54°C
	Coefficient of Thermal Expansion
	Below Tg 57 ppm/°C
	Above Tg 153 ppm/°C
	Die Shear Adhesion
	Si die (3mm x 3mm) to FR4 PCB
	@ 25°C 37 kgf
	@ 230°C 3.2 kgf
	热线：1-3-5-1-0-2-4-6-2-9-8