贴片红胶T-5838

价格：面议

深圳稼稼晨科技发展有限公司

联系人：刘一天

电话：13760466129

地址：深圳市宝安区西乡街道黄田工业城5栋2楼

产品规格：

产品数量：

包装说明：36g,200g,360g

关 键 词：贴片红胶

行 业：

发布时间：2011-10-08

T-5838					           Technical Data Sheet
ONE COMPONENT EPOXY SURFACE MOUNT ADHESIVE 
单组分贴片胶

PRODUCT DESCRIPTION 产品介绍
T-5838  surface mount adhesive is formulated to bond electrical devices or other small parts to printed circuit boards before wave soldering by Stencil Print Method. It has following features. T-5838  贴片胶用于模板印刷法的波峰焊之前将电子元器件或其它的小型部件粘接在印刷电路板上.它具有以下特性.
	A range of dot height with single stencil thickness obtainable 可获得单模板厚度的点高度排列
	Excellent green/wet strength 较佳的未固化/湿强度
	High speed printing 高速印刷

PROPERTIES OF UNCURED MATERIAL 固化前材料性能
Property 
性能	Test Method
测试方法	T-5838
Color/Appearance 颜色/外观	Visual	Viscous Red paste 粘稠红色浆糊
Specific Gravity 密度, g/cc,	ASTM D-792	1.3
Viscosity 粘度, cone & Plate, Pa.s	ASTM D-2393	20-45 (25°C)
Yield strength 屈服强度, cone & Plate, Pa, 25°C		400-600

TYPICAL PROPERTIES OF CURED MATERIAL 固化后材料典型物理性能
Property 
性能	Test Method  
测试方法	Value
数值       
Coefficient of thermal expansion 热膨胀系数, CTE	ASTM D696	85 E-06
Thermal conductivity 导热率, w/m-k	ASTM C177	0.25
Glass transition temperature 玻璃化转变温度, Tg, °C	ASTM D4065	135
Lap shear strength, steel 搭接剪切强度, Mpa		20
Torque strength 扭转强度, FR4 PCB, N.mm		55
Pull off strength 拉离强度, FR4 PCB, N		50
Volume resistivity 体电阻系数, ohms-cm	ASTM D-257	5 E+15
Surface resistivity 表面电阻系数, ohms	ASTM D-257	30 E+15
Dielectric constant 电介质常数	ASTM D150	2.8(1 kHz), 2.7(10 kHz)
Hot solder dip @ 260°C 热浸焊@ 260°C		Pass
Humidity 98%RH / 40°C, 1000 hours, strength retention
相对湿度98%/40°C下1000小时后的强度保持		80% 

DIRECTIONS FOR USE 使用方法
Typical curing condition 典型固化条件:   90 ~ 120 seconds at 150 ºC 在150 ºC下保持90 ~ 120 秒
Curing starts above 100 ºC, with a DSC conversion of 90%, 2 min. at 125 ºC, 10 min. at 100 ºC 固化开始于100 ºC以上, 在125 ºC保温2分钟, 在100 ºC保温10分钟, 热转换为90%.
TYPICAL CURING PERFORMANCE 典型的固化程序
Recommended conditions for curing are exposure to heat above 100 °C (typically 90-120 seconds @ 150 °C). Rate of cure and final strength will depend on the residence time at  the cure temperature. 推荐在**100度条件下固化，（一般，150度温度下固化90-120秒）固化速率和固化强度取决于在固化温度上保持的时间长久.